858-210-2645 • jameslin.amd@gmail.com
As a highly motivated software engineer with a strong background in both computer science and electronics engineering, I have developed a diverse set of skills through my 4+ years of professional full-time experience in the industry. Throughout my career, I have had the opportunity to work with cutting-edge technologies and collaborate with cross-functional teams to deliver innovative solutions. I have experience in developing graph algorithms for accelerators, optimizing software runtime, and enabling GPT/BERT models on accelerators. My current research focus is on search and optimization as well as design automation.
Cerebras offers the fastest AI accelerator, based on the largest processor in the industry.
Cadence is a leading EDA provider delivering software for electronic design.
C/C++, Python, Java, Go
PyTorch, TensorFlow, MLIR, Git, Perforce, Docker, SQL, JenkinsCI/CD, Valgrind, gdb
T.-C. Lin, D. Merrill and Y.-Y. Wu, C. Holtz, and C.-K. Cheng “A Unified Printed Circuit Board Routing Algorithm With Complicated Constraints and Differential Pairs,” in Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), January 2021 (to appear)
T.-C. Lin, C.-C. Chi, and Y.-W. Chang, “Redistribution Layer Routing for Wafer-Level Integrated Fan-Out Package-on-Packages,” in Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), November 2017 (acceptance rate: 105/399=26%)
B.-Q. Lin, T.-C. Lin, and Y.-W. Chang, “Redistribution Layer Routing for Integrated Fan-Out Wafer-Level Chip-Scale Package,” in Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), November 2016 (acceptance rate: 97/409=24%)
B.-Q. Lin, T.-C. Lin, C.-Y. Yang, and Y.-W. Chang, “Redistribution Layer Routing for Integrated Fan-Out Wafer-Level Chip-Scale Packages,” US Patent US 2018/0032660 A1, Feb. 2018